The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates ...
However, traditional methods (such as ASTM D445) are hindered by high maintenance needs, extensive manual input requirements, and time-consuming operations. The advanced patented technology utilized ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback