LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...

FT. LAUDERDALE, FL, June 10, 2025 (GLOBE NEWSWIRE) -- Duke Robotics Corp. (OTCQB: DUKR) ("Duke Robotics" or the "Company"), a leader in advanced robotics technology and autonomous drone solutions, ...

PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights ...

LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart ...

LG Innotek Co., a leading South Korean electronics parts manufacturer, announced on Wednesday that it has developed a next-generation smart integrated circuit (IC) substrate that reduces carbon ...

Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, has announced a new power management ...

SEALSQ Corp (NASDAQ: LAES), ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced ...

Alpha and Omega Semiconductor Supports 800 VDC Power Architecture for Next-Generation AI Factories with Innovative SiC and GaN, Power MOSFET, and Power IC Solutions Alpha and Omega Semiconductor ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Yossef Balucka, Chief Executive Officer of Duke Robotics, commented: "We believe that the development of the ICDS2 represents a significant milestone in our mission to revolutionize utility ...