Upgrading RAM on most computers is often quite a straightforward task: look up the supported modules, purchase them, push a couple of levers, remove the old, and install the new. However, this project ...

This is somewhat Mac related, but I think it's more of a chip issue (esp on factory-assembled boards), so I figured I'd post here. Basically, I'm having repeated failures of an ATI 4850 graphics card ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

(MENAFN- EIN Presswire) EINPresswire/ -- In the fast-paced electronics industry, the ability to produce compact, high-performance devices depends heavily on advanced PCB assembly techniques. FR4PCB, a ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

A.R.T. has upgraded its UK facility by installing the latest BGA rework system from PDR Rework for use in its training ...

Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

If you’re developing a performant IP-KVM based on the Raspberry Pi, an HDMI capture device that plugs into the board’s CSI port would certainly be pretty high on your list of dream peripherals. Turns ...