ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...
ANSAN, South Korea--(BUSINESS WIRE)--Seoul Semiconductor Co., Ltd. (“Seoul”) (KOSDAQ 046890), a leading global innovator of LED products and technology, announced the introduction of its ...
- Paper Presented at 14th IEEE CPMT Symposium Japan (ICSJ 2025) - TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as ...
Ecocera, a prominent manufacturer of ceramic circuit boards, is experiencing enhanced operational performance as it leverages the increasing demand for automotive lighting substrates. This growth is ...
Beijing's push to dominate third-generation semiconductor technology is taking shape along divergent paths, with silicon carbide (SiC) development now accelerating after overcoming technical hurdles ...
Seoul National University’s College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...
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